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Sergiu
Radu has been at Sun Microsystems for over ten years, and has
increased EMC design commonality across Sun’s product lines by writing
and maintaining the company’s EMC design best practices documents,
through presentations and seminars. He has increased the awareness about
EMC issues in new areas for Sun, such as chips and packages and has obtained
patents for some of the new solutions used. He was involved in the first
research at Sun on board stitching, on heatsink grounding, on the effect
of coating on the EMI performance of the chassis, on the effect of internal
compartmentalization of the chassis, on the generalized use of a unified
grounding structure (as opposed to the I/O grounding islands), and many
other initiatives, all these being now standard design practices at Sun
and in the industry.
With a strong background in both electromagnetics and circuits, and with
a solid experience in research, he was involved not only in the EMC design
of a very large number of Sun projects (60+ products, 250+ boards), but
he was also actively involved in the IEEE EMC Society through publications,
in collaborative research with universities and in internal research leading
to patents, publications, internal reports and better solutions for Sun’s
products.
Sergiu’s presentation topics include:
1. Engineering Aspects of Electromagnetic Shielding
All electronic equipment uses some type of shielding, and from a theoretical
point of view, electromagnetic shielding is among the difficult areas
of EMC. The lecture introduces basic shielding concepts, insisting on
their practical limitations, and presents the typical engineering problems
associated with shielding. Among the aspects discussed are the materials
used for shielding, chassis resonances, shielding integrity problems
(seams, joints, apertures, perf patterns), aperture coupling and a shield’s
grounding.
2. An Overview of Chip Level EMC Problems
The CPUs and the VLSI chips are the primary sources of electromagnetic
noise in all electronic equipment. Reducing the electromagnetic noise
at the source level is usually the best and the most economical solution.
The lecture presents typical interference mechanisms associated with
CPU/VLSI, as well as mitigation methods at die-level and package level.
Among the aspects discussed are some power distribution issues, on-die
decoupling, package capacitors, routing aspects, the impact of back-bias
and forward-bias, and the impact of die-shrinks on the EMI performance
of the VLSI chips.
3. Engineering Aspects of PCB Level EMC Design
PCB design is a complex cooperation between electrical, mechanical,
thermal, SI, PI and EMC design. In a practical design, the EMC design
engineer has to make trade-offs and understand the relative impact of
different design choices. The lecture is an overview of the typical
PCB design aspects and their role for EMC performance. Among the aspects
discussed are placement, stack-up, routing, decoupling, and grounding
aspects. The design of the I/O ports, in order to pass the emissions
and immunity tests, is also discussed in greater detail.
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Ji
Chen worked in Motorola’s wireless handset division before
joining the University of Houston in 2001. During the past 15 years, he
has mainly worked on the modeling, simulation, and most recently, the
measurement of electromagnetic field interaction with human subjects for
various applications.
Ji’s presentation topics
include:
1. EMC/EMI Issues in Biomedical Engineering
For this topic he will discuss the interactions between electromagnetic
devices and biomedical systems. In particular, he will discuss electromagnetic
devices such as walk-through metal detectors and the MRI RF coil in
human subjects and implanted devices.
2. EMC/EMI in Wireless Communications
SAR and board-level electromagnetic modeling will be discussed in this
presentation.
3. Developing Nano-scale Structures for EMC/EMI
In this presentation, he will discuss the modeling and development of
micro-leveled periodic structures for EMC applications.
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